Pinterest Debuts New Ad Formats and Paid Partnership Tool

Pinterest’s Idea Pins creator platform has been described as a cross between TikTok videos and Facebook Stories. Now the social platform is extending brands’ similar creativity with Idea Ads, which can also combine video, images and music. Idea Ads can be created by the brands themselves or in collaboration with a Pinterest user, in which case the results are categorized as “Idea ads with paid partnership.” The idea is to extend brands boxed-in by video-first platforms the chance to engage users with mixed media for elements critical to DIY projects, like a printable ingredient or supply lists. Continue reading Pinterest Debuts New Ad Formats and Paid Partnership Tool

Spotify Expands Ad Options by Targeting Podcast Listeners

Spotify, which now has 123 million worldwide users of its ad-supported audio service, is expanding its podcast business by offering advertisers the ability to target consumers based on the types of podcast programs they are streaming. Brands across 10 global markets (Australia, Brazil, Canada, France, Germany, Italy, Mexico, Spain, United Kingdom and United States) will have the option of targeting Spotify Free users based on podcast categories such as “Business & Technology,” “Comedy” and “Lifestyle & Health.” 3M and Samsung have been testing the new ad-targeting tool. Continue reading Spotify Expands Ad Options by Targeting Podcast Listeners

Facebook Stock Plunge Proves Tech Firms Aren’t Bulletproof

The myth that the stock of the tech behemoths will only increase in value was shattered this last week when Facebook’s shares tumbled 19 percent, erasing about $120 billion in shareholder wealth. That loss represents among the largest one-day dip in market value that any company has suffered. Facebook’s loss began when it released disappointing Q2 earnings and warned investors of a “sharp slowdown in sales growth” in the next quarters as well as more spending for security and privacy. Continue reading Facebook Stock Plunge Proves Tech Firms Aren’t Bulletproof

Report: Apple and Google Battle for Top Spot in Global Brands

This year’s edition of Interbrand’s “Best Global Brands” report places Apple in the No. 1 spot as the world’s most valuable brand for the second year in a row. Apple and No. 2 brand Google knocked Coca-Cola to the No. 3 spot last year. The top three positions are the same for 2014. The report, which provides a ranking of the top 100 valuable global brands, list a growing number of technology brands. Microsoft, Samsung and IBM are listed in the top 10, while Intel, Cisco, Amazon, Oracle and HP are in the top 20. Continue reading Report: Apple and Google Battle for Top Spot in Global Brands

3M and Nanosys to Bring Quantum Dot Tech to CE Devices

Quantum dot technology reportedly makes displays more colorful while consuming less power, and development by 3M and Nanosys is nearly ready for use in smartphones, tablets and TVs. 3M issued a press release on Tuesday announcing that its Quantum Dot Enhancement Film (QDEF), which allows up to 50 percent more color than current levels in LCD devices, will be made available to manufacturers starting late in the second quarter of this year. Continue reading 3M and Nanosys to Bring Quantum Dot Tech to CE Devices

Innovation: IBM and 3M to Jointly Develop Super-Fast 3D Semiconductors

  • IBM and 3M have announced they will partner to build 100 layer silicon towers that promise a “computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.”
  • “That’s a heady claim for a tech that doesn’t yet exist, but is already taking swings at current faux 3D transistors,” comments Engadget.
  • Under the agreement, IBM will provide its experience in packaging the new processors, while 3M will develop an adhesive that can be applied in batches and allow for heat transfer without damaging logic circuitry.
  • If successful, the companies would create commercial microprocessors composed of layers of up to 100 chips. According to the press release: “Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a ‘brick’ of silicon… The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D packaging.”