Silicon Archives - Page 2 of 2

Disney Partners with Techstars to Launch Accelerator Program

By Rob Scott
February 14, 2014

The Walt Disney Company has announced a partnership with Techstars to launch an accelerator program that will help 10 startups get off the ground, while potentially providing the media giant insight into new innovation and creativity. Disney Accelerator plans to invest $120,000 in each startup, and provide them with the opportunity to work with Disney for three months starting in June (the application deadline is April 16). At the end of the program, Disney and Techstars may take a stake in one or more of the startups. Continue reading Disney Partners with Techstars to Launch Accelerator Program

New Supercapacitor Can Store Electricity on Silicon Chips

By Chris Castaneda
October 25, 2013

A materials research team at Vanderbilt University has designed a new supercapacitor that is made of silicon and has the potential to power many types of devices, from solar cells to mobile devices. The supercapacitor may be made from excess silicon and can provide significant savings in manufacturing costs. The technology cannot store energy the same as lithium-ion batteries, but supercapacitors have promise in consumer devices.

Continue reading New Supercapacitor Can Store Electricity on Silicon Chips

Stanford Scientists Build Computer Using Carbon Nanotubes

By Rob Scott
October 1, 2013

A team of engineers at Stanford University has built the first functioning computer that uses carbon nanotubes rather than the standard silicon. The new material for building transistors could dramatically impact the way computers work in the future. While others have discussed the possibility of carbon nanotubes for years, Stanford’s team is the first to put them to practical use. The material could launch a new generation of devices that run faster and use less energy. Continue reading Stanford Scientists Build Computer Using Carbon Nanotubes

Xerox PARC Tests Silicon Chiplets for Micro Manufacturing

By emeadows
April 12, 2013

The team at Xerox’s Palo Alto Research Center (PARC) recently demonstrated a concept in which slivers of silicon, or electronic circuits called “chiplets,” dance around under a microscope until commanded to settle accurately on a pattern of circuit wires — each settling at an exact point of contact. These chiplets are part of a new system Xerox envisions for making electronics that take advantage of the laser printer. Continue reading Xerox PARC Tests Silicon Chiplets for Micro Manufacturing

Innovation: IBM and 3M to Jointly Develop Super-Fast 3D Semiconductors

By Rob Scott
September 8, 2011

IBM and 3M have announced they will partner to build 100 layer silicon towers that promise a “computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.”
“That’s a heady claim for a tech that doesn’t yet exist, but is already taking swings at current faux 3D transistors,” comments Engadget.
Under the agreement, IBM will provide its experience in packaging the new processors, while 3M will develop an adhesive that can be applied in batches and allow for heat transfer without damaging logic circuitry.
If successful, the companies would create commercial microprocessors composed of layers of up to 100 chips. According to the press release: “Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a ‘brick’ of silicon… The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D packaging.”