Semiconductor giant Intel has reached a tentative agreement with Taiwan’s TSMC and some U.S. firms to create a joint venture that would assume operating responsibility for Intel’s chip fabrication plants here. TSMC will reportedly hold a 20 percent stake in the JV, while Intel and the other investors would control the remaining 80 percent. This specific JV is limited to Intel’s foundry unit, which posted a 2024 operating loss of $13.4 billion in 2024 and is not expected to break even until 2027. New Intel CEO Lip-Bu Tan said at last week’s Intel Vision conference that he will spin off all non-core units. Continue reading TSMC Reportedly Ready for Joint Venture with Intel Foundries

Taiwan’s Foxconn, the contract manufacturer that assembles Apple’s iPhones, has built its own AI. Called FoxBrain, the company says the large language model was trained in just four weeks with help from Nvidia, using 120 of that company’s H100 chips. FoxBrain has reasoning and mathematical skills and can analyze data and generate code. Initially built for in-house use, Foxconn says it intends to open source the model and hopes it will become a collaborative tool for its partners and enable advancements in manufacturing techniques and supply-chain management. Continue reading Foxconn AI Trained in Four Weeks, Suggesting Industry Shift

Taiwan semiconductor firm TSMC, the world’s largest chipmaker, has vowed to add another $100 billion to its existing $65 billion plan to expand its U.S. manufacturing base. The total allocation — $165 billion over the next four years — sees TSMC further building out its advanced semiconductor fabrication complex in Phoenix, Arizona, which has been producing at volume since late 2024. The expansion plays a key role in strengthening the U.S. computer ecosystem by increasing U.S. production of advanced semiconductors, TSMC says, adding that it will “complete the domestic AI supply chain” with advanced packaging investments. Continue reading TSMC Will Boost Its Factory Build-Out in U.S. by $100 Billion

Optoma has announced the Photon Go, a tiny ultra short-throw laser projector that throws a 100-inch image from a distance of just 9.8 inches. Releasing in April, the portable device is “designed to bring big-screen entertainment just about anywhere,” the company says, emphasizing the device’s 10 x 6 x 2.5-inch size and 3.8-pound weight — notable because UST projects are not typically very portable. Featuring RGB triple laser technology for vibrant colors and nuanced contrast, the Photon Go “can transform any wall into a screen,” according to the Taiwanese manufacturer. Continue reading Optoma Photon Go: Portable UST Projector with Triple Laser

OpenAI is getting close to finalizing its first custom chip design, according to an exclusive report from Reuters that emphasizes the Microsoft-backed AI giant’s goal of reducing its dependency on Nvidia chips. The blueprint for the first-generation OpenAI chip could be finalized as soon as the next few months and sent to Taiwan’s TSMC for fabrication, which will take about six months — “unless OpenAI pays substantially more for expedited manufacturing” — according to the report. Even by usual standards, the training-focused chip is already on a fast track to deployment. Continue reading OpenAI In-House Chip Could Be Ready for Testing This Year

OpenAI CEO Sam Altman’s ongoing effort to fund a new initiative to produce chips to power artificial intelligence has graduated from a billion-dollar venture to a trillion dollar undertaking that aims at nothing less than “to reshape the business of chips and AI,” per recent reports. The United Arab Emirates has joined the list of sources of potential funding for the global project, which seeks to remedy the tight supply of AI chips that Altman is said to view as an obstacle to OpenAI’s effort to develop artificial general intelligence, which he defines as “systems that are generally smarter than humans.” Continue reading Sam Altman Is Reportedly Seeking ‘Trillions’ to Fund AI Chips

Canon is gearing up to begin shipping its new nanoimprint lithography chipmaking machines, possibly this year. The equipment — which uses a stamping process Canon says will be cheaper and more energy-efficient than ASML’s light-based extreme ultraviolet (EUV) technology — could be a disruptor in a market dominated by the Dutch company. Such machines, essential in manufacturing semiconductors, imprint circuitry onto silicon wafers in patterns that can be thousands of times thinner than the width of a human hair. Foundries TSMC, Samsung Semiconductor and Intel rely on ASML’s EUV machines in the manufacture of high-end chips. Continue reading Canon Could Begin Shipping Chip Stamping Machine in 2024

Further insights into OpenAI CEO Sam Altman’s global fundraising effort for a multi-billion dollar computer chip venture now appears to be toward a goal establishing a network of semiconductor plants to manufacture AI chips, according to media reports. The plan would see the 38-year-old entering a hotly competitive yet underserved field, dominated by Nvidia and increasingly Intel, AMD and Qualcomm. Apparently, he feels the existing players aren’t set up to produce the amount of chips required to meet the goals of OpenAI and others through 2030, now that many businesses incorporate AI into workflows and consumer products. Continue reading Altman Is Seeking Billions in Global Funding for AI Chip Plants

Taiwanese tech powerhouse MSI (Micro-Star International) has a new handheld gaming device called the Claw that uses an Intel Core Ultra 5 or 7 chip and Intel Arc graphics, making it among the most powerful portable PC gaming devices on the market. The device breaks from tradition, as competing mobile game units like the Steam Deck, the Asus ROG Ally and the Lenovo Legion Go all use AMD chipsets. The MSI system — demonstrated at CES 2024 in Las Vegas — is expected to be priced between $699 to $799 in a trio of configurations when it hits the market in February or March. Continue reading CES: MSI Claw Is First Gaming Handheld with Intel Core Ultra

AMD is coming to market with a new slate of chips optimized for artificial intelligence, including the AMD Instinct MI300 Series data center AI accelerators, ROCm 6 open software stack with new features for large language models, and Ryzen 8040 Series processors with Ryzen AI. The new offerings have received a welcome reception from customers including Microsoft, Oracle, Meta Platforms and Dell, among others that can benefit from building a strong network of suppliers of AI chips. The market is currently dominated by Nvidia, which is challenged to meet existing demand. Continue reading AMD’s New AI Chips Get Welcome Reception from Enterprise

YouTube has adjusted the requirements for its Partner Program (YPP), making it easier for creators with smaller followings to earn money. The Google subsidiary has cut in half — to 500 — the minimum number of subscribers required for creators to monetize across paid chat, shopping, tipping, channel memberships and more. Other thresholds have also been lowered, with valid watch hours reduced to 3,000 (from 4,000) and Shorts views cut to 3 million (as opposed to 10 million). The new parameters are initially effective in the U.S., Canada, UK, Taiwan and South Korea. Continue reading YouTube Lowers Monetization Threshold to Attract Creators

Despite moving a significant portion of its chip work in-house, Apple is extending its chip-supply contract with Broadcom in a deal estimated to be worth more than $15 billion with plans to run through 2026. The chip manufacturer will provide Apple with components for wireless connectivity, including 5G radio-frequency. There had been speculation that Apple planned to phase out Broadcom. Some see the deal as Apple’s capitulation to political pressure to source more U.S. manufacturing. Broadcom’s 5G-capable manufacturing hubs are located in U.S. cities including Fort Collins, Colorado, where Broadcom has a major facility. Continue reading Apple’s 5G Broadcom Extension Valued More Than $15 Billion

Leaders at the G7 Summit in Hiroshima, Japan, are calling for discussions that could lead to global standards and regulations for generative AI, with the aim of responsible use of the technology. The chief executives of the world’s largest economies — which in addition to the host nation include Canada, France, Germany, Italy, the UK, the U.S. (and additionally the EU) — expressed the goal of forming a G7 working group to establish by the end of the year a “Hiroshima AI process” for discussion about uniform policies for dealing with AI technologies including chatbots and image generators. Continue reading G7 Leaders Call for Global AI Standards at Hiroshima Summit

Ten years ago AMD introduced the concept of smaller, interconnected chips that together work like one digital brain. Sometimes called “chiplets,” they’re generally less expensive than building one large chip, and when grouped together into bundles have often outperformed single wafters. In addition to AMD, companies including Apple, Amazon, Intel, IBM and Tesla have embraced the chiplet formula, which leverages advanced packaging technology, an integral part of building advanced semiconductors. Now experts are predicting packaging is going to be even more of a focus in coming years, as the global chip wars heat up. Continue reading Advanced Packaging for ‘Chiplets’ a Focus of CHIPS Funding

Taiwan’s TSMC, the largest semiconductor manufacturer in the world, is seeking $15 billion in U.S. subsidies to help build two chip factories in Arizona, but is pushing back against terms that include sharing detailed information about its stateside operations and possibly profits. Some South Korean semiconductor firms are also said to have raised objections. The White House contends the criteria are in place to protect American taxpayers and ensure the subsidies are being spent as intended. TSMC has pledged $40 billion of its own funds for the project. Continue reading TSMC Seeks $15 Billion in U.S. Incentives to Build Foundries