Intel announced its 13th-gen family of laptop CPUs, including new entry-level chips and its flagship Core i9-13980HX, the high-end of its mobile processor collection (based on Raptor Lake architecture), featuring 24 cores and an impressive boost speed of 5.6GHz. The HX-series includes similar features to Intel’s 12th-gen lineup, such as 32 EUs of onboard graphics capability and support for DDR5 and DDR4, but promises significantly faster speeds to multithreaded performance. When compared to the earlier Core i9-12900HK, Intel claims game performance increases of up to 12 percent and a massive 74–79 performance jump when rendering a scene in Blender. Continue reading CES: Intel Rolls Out 13th-Generation Lineup of Laptop CPUs

What some call “Apple’s unchecked dominance” in mobile phones may get a real challenge from Samsung’s upcoming Galaxy S23 Ultra, expected to hit the market in Q1. The new model will be powered by Qualcomm’s Snapdragon 8 Gen 2 chips, which benchmarks have shown to be fast approaching the performance of Apple’s A16 Bionic. There is also a rumor that Samsung may take a page from Google and Apple and begin designing bespoke phone chips. Samsung already has a chip foundry, but it is independent of the company’s mobile unit, a Switzerland for its diversity of phone customers. Continue reading Samsung to Take on Apple with Upcoming Galaxy S23 Ultra

TSMC has revised plans for its Arizona chip plant, reportedly the result of pressure from customers including Apple, Nvidia and AMD, who urged the Taiwanese company to reconsider its plan to output 5-nanometer processors that will be old news by the time the $12 billion plant opens in 2024. TSMC is expected to announce during a scheduled Tuesday visit by President Biden and Commerce Secretary Gina Raimondo that it will output advanced 4-nanometer chips when production commences and will add a second nearby plant to manufacture even more sophisticated 3-nanometer chips. Continue reading TSMC’s Advanced Chipmaking Plans Leak Before Biden Visit

Amazon Web Services, a leading provider of cloud computing services, is rolling out its new ARM-based Graviton3E chips for high-performance workloads, including tasks like weather forecasting and gene sequencing. AWS customers can rent the high-performance computing (HPC) power to take advantage of “performance gains and cost savings” as a result of making its own chips, Amazon says. The move makes AWS something of a competitor to other top chipmakers, including Intel, AMD and Nvidia, who continue to be among Amazon’s major chip suppliers. Amazon says it will continue to offer HPC services that rely on third-party chips. Continue reading AWS Touts HPC with Launch of Graviton3E Chip at re:Invent

Artec 3D is a Luxembourg-based manufacturer of 3D scanning hardware and software with offices in Moscow and Santa Clara, California. At CES 2018, the company demonstrated its $25,800 professional 3D scanner dubbed Artec Leo. With the handheld scanner’s built-in processor, there is no need for an external computer, “making 3D scanning as easy as taking a video.” The company claims that its 80 fps 3D reconstruction rate makes its device “the fastest professional handheld 3D scanner on the market.” The Leo offers a large field of view for accurately scanning and processing large scenes and objects. Continue reading Artec 3D Demonstrates Fast and Accurate 3D Scanning at CES

Following its recent Nasdaq debut, Roku is updating its product line with new specs and pricing in addition to a number of software enhancements. Roku’s entire line — from its streaming stick to home entertainment hub — is being upgraded. The $30 Roku Express gets a new processor, while the $50 Roku Streaming Stick now features a remote with voice control. The $40 Roku Express+ is the next step up from the Roku Express, offering analog component connections for those with older TVs. And the high-end 4K Roku Ultra will remain $100 for the holiday season (it recently had a $30 reduction), and gets a refresh for its remote and a wider selection of streaming options.  Continue reading Roku Refreshes Product Line to Compete With Apple, Amazon

GoPro has unveiled two new action cameras, the Hero6 Black, an updated version of its flagship camera targeting adventurous photographers, and the Fusion, a 360-degree spherical camera that will ship in November. The Hero6 Black includes a first-ever custom processor built for GoPro, and includes a digital zoom, better voice control, more user-friendly editing software and the ability to transport footage three-times faster than the previous version. It is priced at $499, about $100 more than its predecessor. Continue reading GoPro Debuts Hero6 Black and 360-Degree Fusion Cameras

Microsoft is developing a chip designed specifically for artificial intelligence processing. A version of its Holographic Processing Unit, used for its HoloLens headset, the new chip will be integrated with the next version of HoloLens, to be launched at an as-of-yet undetermined date. Microsoft isn’t alone in taking chip manufacturing in-house, especially with regards to AI processing. Apple’s iPhone prototypes include the company’s AI-specific chip, and Google is working on its own second-generation AI chip. Continue reading Microsoft Develops Its Own Chips to Power AI in the Cloud

Hewlett Packard Enterprise introduced a prototype computer dubbed The Machine, which has a single 160-terabyte memory bank that can simultaneously process the data found in 160 million books. This never-before-accomplished feat reveals the potential of what’s called Memory-Driven Computing. The custom-built computer is, says HPE, the world’s largest single-memory computer, based on the largest R&D program in HPE’s history. The Machine, it adds, and its capabilities will be transformational. Continue reading HP Introduces Memory-Driven Computing With ‘The Machine’

Wisconsin-based startup Fasetto demonstrated its LINK storage and communications device at CES 2017. Ideal for media production, the portable Wi-Fi and Bluetooth 4G connected device might be the easiest way to distribute video via up to 15 mixed devices. A production unit merely needs access to a web browser and a little more than eight hours of battery charging time for streaming distribution. This device might also function as a budget version of on-set video support. The compact design (2-inches by 2-inches by 1-inch deep and a mere 4 ounces) packs up to 2TB of solid state storage with a 64 bit octa-core 2.1GHz Exynos 7420 processor and 4GB of RAM. Continue reading CES: Fasetto Rolls Out a New Class of Connectivity with LINK

Intel demonstrated the first version of its Project Alloy headset, a “wearable” computer that enables a combination of virtual and augmented realities, or “merged reality.” At CES 2017, Intel chief executive Brian Krzanich announced Project Alloy will ship in Q4 this year, a fairly quick turnaround for a headset/project only first made public in August 2016. Project Alloy is evidence of Intel’s effort to position itself as a leader in wearable computing, in which the device contains all its essential computing components. Continue reading Intel Demos Merged Reality Headset, Compute Card, 5G Modem

Nvidia introduced Titan X, a new chip that is a successor to a current chip with the same name, targeted at the high-end gaming and artificial intelligence communities. Priced at $1,200 and available beginning August 2, the new Pascal-based Titan X chip offers 12 billion transistors, compared to seven billion on a high-end Intel chip. The new Titan X will be available as an add-on card for PCs. Nvidia’s closest competitor, Advanced Micro Devices (AMD) offers a similar chip for PCs and game consoles. Continue reading Nvidia Rolls Out Titan X Chip for Games, Artificial Intelligence

ConductorIO VP of business development and operations Monique Bradshaw talked about the paradigm change from local, on-premise infrastructure to the cloud. “The paradigm shift means a fundamental change in approach of underlying assumption,” she said during an ETC Cloud Innovation Conference keynote at NAB. “We’re seeing a big change in the ways that companies are looking at their rendering.” In five years, she noted, 90 percent of respondents to a survey think they’ll have at least some of their rendering in the cloud, up from close to 60 percent today. Continue reading Cloud Conference: Moving From Local to Cloud Infrastructure

Clarion is bringing what it claims to be the first fully digital, in-car audio system to CES this week. The company’s Full Digital Sound (FDS) system also plays high-resolution audio. “This all-digital approach operates on a purely digital audio signal from the source to the speaker voice coils, resulting in pristine sounding audio with zero loss in quality and no added noise from DACs or analog connections,” explained the company. The digital signal travels from the head unit to a processor and then to the speakers; at no point is it converted from digital to analog or passed through an amplifier. Continue reading Clarion to Demo its New Full Digital Car Sound System at CES

During the IFA trade show in Berlin yesterday, Panasonic unveiled its 65CZ950, a curved 4K OLED TV featuring the company’s Studio Master Drive processor. Panasonic claims the 65-inch OLED, slated for an October release in Europe, is the most color-accurate display it has ever produced. It is also the first to achieve THX certification. Panasonic says the CZ950 series brings home entertainment closer to a cinema experience since it is fully HDR compatible and covers more than 90 percent of the DCI color space. Continue reading Panasonic Joins LG in OLED Market with Curved 4K Offering