Amazon Hires Engineering Team to Design Its Own Server Chips

Retail and cloud giant Amazon has joined Google and Facebook in investing in development its own server chips. The company recently brought together a team of CPU architects and hardware development engineers, four of whom come from Calxeda, the defunct ARM-based server startup in Austin, Texas. Despite the high initial costs of custom server chips, these specialized products would allow Amazon to optimize costs and improve performance. Continue reading Amazon Hires Engineering Team to Design Its Own Server Chips

Samsung to Manufacture its Own 64-Bit Core for Mobile Chips

Samsung revealed new design plans with investors Wednesday at its Analyst Day event in South Korea. The company will now design its own custom 64-bit core for mobile chips, and it’s working on even higher resolution displays. By 2015, Samsung projects it will bring 4K displays to phones. Also in the works are flexible AMOLED screens. It’s a big transition for a company that seems to want to possess greater control of its own products. Continue reading Samsung to Manufacture its Own 64-Bit Core for Mobile Chips

Sources Say Intel Advancing with TV Service Content Deals

Intel’s talks to purchase media content for a new TV service are moving forward, according to people familiar with the matter. Although Intel has yet to close any programming deals, the chip giant is reportedly offering to pay as much as 75 percent more for content than traditional cable rates. Sources indicate that Intel has moved substantially on subscriber fees it is willing to pay and has also suggested preventing viewers from skipping commercials for a show’s first run. Continue reading Sources Say Intel Advancing with TV Service Content Deals

Slumping PC Sales: Will TV Service be the Answer for Intel?

Many were perplexed when Intel revealed it would launch a TV service. But the company, along with other giants such as Apple, Google and Microsoft have wrestled for years with how to become TV providers amidst a market ripe for disruption. And as the pay TV landscape continues to shift, with new emerging social and mobile opportunities, tech companies are well-positioned to step in and exploit. Continue reading Slumping PC Sales: Will TV Service be the Answer for Intel?

Will Future Intel Chips Provide MacBooks with Infinite Battery Life?

  • Intel introduced its new Haswell architecture this week at the Intel Developer Forum in San Francisco. The Haswell technology is a few generations away, but is already impressing analysts.
  • John Brownlee, writing for Cult of Mac, explains that Haswell was created using a 22 nanometer 3D transistor process, which makes possible ARM-like power consumption on an x86 chip. “That means all day battery life, as well as ten days of connected standby,” writes Brownlee.
  • The architecture reportedly uses up to 20 times less power than current Intel chips, and can actually run on a solar cell, suggesting that future MacBooks would theoretically have no constraints on battery life.
  • According to Brownlee, the Haswell architecture has some serious potential: “You think those new Sandy Bridge MacBook Pros are beasts? Just wait a couple years. That’s when Apple will be able of releasing bleeding edge MacBooks capable of not only running for 24 hours on a single charge, but of recharging their cells as they run by sucking up the ambient light in the room around them. Wow.”

Innovation: IBM and 3M to Jointly Develop Super-Fast 3D Semiconductors

  • IBM and 3M have announced they will partner to build 100 layer silicon towers that promise a “computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.”
  • “That’s a heady claim for a tech that doesn’t yet exist, but is already taking swings at current faux 3D transistors,” comments Engadget.
  • Under the agreement, IBM will provide its experience in packaging the new processors, while 3M will develop an adhesive that can be applied in batches and allow for heat transfer without damaging logic circuitry.
  • If successful, the companies would create commercial microprocessors composed of layers of up to 100 chips. According to the press release: “Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a ‘brick’ of silicon… The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D packaging.”