Intel, Warner Bros. Unveil AV Entertainment Experience Plans

During this week’s LA Auto Show, Intel and Warner Bros. announced a partnership to develop in-cabin, immersive experiences for autonomous vehicles. The companies are creating the AV Entertainment Experience, which Intel chief Brian Krzanich describes as “a first-of-its-kind proof-of-concept car to demonstrate what entertainment in the vehicle could look like in the future.” Since Americans spend an average of 300 hours per year driving, there is a wealth of possibilities for using that time differently when automobiles become self-driving. The collaboration is looking beyond movies and TV programming to more immersive experiences. Continue reading Intel, Warner Bros. Unveil AV Entertainment Experience Plans

Intel to Leverage RealSense for Augmented Reality Headset

Intel is leveraging RealSense, its 3D camera technology, to develop a wearable headset for augmented reality, say sources knowledgeable about the chip maker’s plans. Those same sources report that Intel is more likely to license its headset design to other manufacturers rather than produce its own branded model. Intel’s RealSense could potentially help distinguish its technology offering in a field that already includes many major companies such as Apple, Microsoft, Alphabet’s Google and dozens of startups. Continue reading Intel to Leverage RealSense for Augmented Reality Headset

Low-Cost Raspberry Pi Computer Enjoys Surprising Popularity

The affordable Raspberry Pi microcomputer — launched three years ago with the modest hope of selling a few thousand units — just passed the five million sales mark. The Raspberry Pi Foundation offers its no-frills Model A Pi for $25 and the Model B for $35. It recently launched the 6x faster Model B Pi 2 with double the memory for only $35. Originally intended as a cost efficient solution for students, the simple microcomputer is now being used to build everything from DIY computers to robotics projects. Continue reading Low-Cost Raspberry Pi Computer Enjoys Surprising Popularity

Sensors/MEMS Session: Biometric Information for Wearables

Developers of health and fitness wearables — currently the industry’s biggest segment — are challenged with providing accurate and reliable biometric information. If the consumer cannot be convinced that calories burned, steps taken, and blood pressure numbers do not reflect reality, then health and fitness wearables will never gain the traction they need to become mass market. Enter Valencell, a core technology provider for biometric information to silicon providers and OEMs. Continue reading Sensors/MEMS Session: Biometric Information for Wearables

Researchers Print Micro Circuits with Cheap Ink-Jet Printers

Researchers from Georgia Tech, the University of Tokyo, and Microsoft Research have developed a technique in which cheap, functional electric circuits can be printed using only $300 of material and equipment. This technique uses silver nanoparticle ink instead of utilizing sintering. The researchers were able to print a circuit in roughly 60 seconds onto almost any material that can go through a printer, though some materials worked better than others. Continue reading Researchers Print Micro Circuits with Cheap Ink-Jet Printers

Intel Emphasizes Mobile Focus, More Attention on Atom Chip

Intel’s leadership promised on Friday to place their chip processors in position to enter the mobile and other non-computer markets. Despite their planned release of a TV set-top box, Intel is entering the new field with caution. In contrast, it is focusing much effort on its chip making. Intel will attempt to bring their Atom chips to a more equal level with their Core line of computer chips, and compete directly with ARM processors. Continue reading Intel Emphasizes Mobile Focus, More Attention on Atom Chip

Innovation: IBM and 3M to Jointly Develop Super-Fast 3D Semiconductors

  • IBM and 3M have announced they will partner to build 100 layer silicon towers that promise a “computer chip 1,000 times faster than today’s fastest microprocessor enabling more powerful smartphones, tablets, computers and gaming devices.”
  • “That’s a heady claim for a tech that doesn’t yet exist, but is already taking swings at current faux 3D transistors,” comments Engadget.
  • Under the agreement, IBM will provide its experience in packaging the new processors, while 3M will develop an adhesive that can be applied in batches and allow for heat transfer without damaging logic circuitry.
  • If successful, the companies would create commercial microprocessors composed of layers of up to 100 chips. According to the press release: “Such stacking would allow for dramatically higher levels of integration for information technology and consumer electronics applications. Processors could be tightly packed with memory and networking, for example, into a ‘brick’ of silicon… The companies’ work can potentially leapfrog today’s current attempts at stacking chips vertically – known as 3D packaging.”