Qualcomm Inks Partnerships With 5G Device Makers, Carriers

For 5G to take off, manufacturers have to produce devices that integrate the technology. To that end, Qualcomm has partnered with 19 device makers, all of which will be relying on the chipmaker’s new Snapdragon X50 5G-compatible modem in at least one of their devices. Qualcomm has inked additional partnerships with global carriers, which will also be using the X50 modem for their 5G trials. All four major U.S. networks will begin their rollout of 5G networks by the end of this year, with full nationwide coverage by 2020. Continue reading Qualcomm Inks Partnerships With 5G Device Makers, Carriers

New Patent Group Wants Royalties for 4K HEVC Video Codec

HEVC Advance, a new patent group, has warned that it will demand royalties for the HEVC video codec that allows 4K streaming within the same bandwidth now used for 1080p streaming. HEVC, which also can provide 1080p streaming in half the bandwidth, has been seen as the best solution for cost-effective 4K, and the current threat could torpedo its adoption. Currently, HEVC-supported smart TVs have enabled Netflix’s 4K services on those receivers; some smartphones also use HEVC. Continue reading New Patent Group Wants Royalties for 4K HEVC Video Codec

Intel Looks to Eliminate PC Cables with its Skylake Platform

Intel believes that the wireless display and charging features of its next-generation Skylake platform will soon result in Intel reference designs that will eliminate all cables from personal computers. During Computex, the chipmaker detailed how docking, wireless power and connectivity will form the foundation of its post-Broadwell reference designs. Skylake is expected by the second half of next year, suggesting that devices based on Intel’s designs would hit the market as soon as 2016. Continue reading Intel Looks to Eliminate PC Cables with its Skylake Platform

NTT Docomo Plans Trials of New High-Bandwidth Network Tech

Japanese mobile giant NTT Docomo is currently planning new wireless trials that could increase the capacity of future mobile networks to 10 Gbps (1,000 times today’s LTE networks). The new radio technologies could become an important part of a future 5G standard. NTT Docomo is working with Alcatel-Lucent, Ericsson, Fujitsu, NEC, Nokia and Samsung to perform lab trials at Docomo’s research & development facility in Yokosuka, which is expected to be followed by outdoor trials in 2015. Continue reading NTT Docomo Plans Trials of New High-Bandwidth Network Tech

New Initiative Gets Companies to Fund Open Source Projects

More than a dozen companies have joined the Core Infrastructure Initiative to provide funding to open source projects, starting with OpenSSL. The Linux Foundation, Amazon, Cisco, Dell, Facebook, Fujitsu, Google, IBM, Intel, Microsoft, NetApp, Rackspace, Qualcomm, and VMWare have each pledged $100,000 over the next three years to pay for full-time developers, security audits, computing and testing infrastructure, and more to help financially strapped open source projects. Continue reading New Initiative Gets Companies to Fund Open Source Projects

Sharp Takes Display Technology to New Levels with Prototypes

Sharp, which became the first to bring IGZO display technology to the mass market in 2013, is showcasing a number of eye-popping display prototypes that may find their way into devices in the next 12 months. Among them, a MEMS display and “narrow border” screens that will further slim down phones, notebooks and tablets. For example, the Ultra High Resolution “Quad Full HD,” or QFHD LCD screen, offers a 15.6-inch 3840×2160 pixel display, four times that of normal HD. Continue reading Sharp Takes Display Technology to New Levels with Prototypes