Canon Could Begin Shipping Chip Stamping Machine in 2024

Canon is gearing up to begin shipping its new nanoimprint lithography chipmaking machines, possibly this year. The equipment — which uses a stamping process Canon says will be cheaper and more energy-efficient than ASML’s light-based extreme ultraviolet (EUV) technology — could be a disruptor in a market dominated by the Dutch company. Such machines, essential in manufacturing semiconductors, imprint circuitry onto silicon wafers in patterns that can be thousands of times thinner than the width of a human hair. Foundries TSMC, Samsung Semiconductor and Intel rely on ASML’s EUV machines in the manufacture of high-end chips. Continue reading Canon Could Begin Shipping Chip Stamping Machine in 2024

Altman Is Seeking Billions in Global Funding for AI Chip Plants

Further insights into OpenAI CEO Sam Altman’s global fundraising effort for a multi-billion dollar computer chip venture now appears to be toward a goal establishing a network of semiconductor plants to manufacture AI chips, according to media reports. The plan would see the 38-year-old entering a hotly competitive yet underserved field, dominated by Nvidia and increasingly Intel, AMD and Qualcomm. Apparently, he feels the existing players aren’t set up to produce the amount of chips required to meet the goals of OpenAI and others through 2030, now that many businesses incorporate AI into workflows and consumer products. Continue reading Altman Is Seeking Billions in Global Funding for AI Chip Plants

Intel Has Plans to Power AI with Glass Substrates for Its Chips

Intel has unveiled a new glass substrate technology that it says will “benefit our key players and foundry customers for decades to come.” The result of 10 years and $1 billion in development, the concept substitutes glass for the usual resin in which processors are embedded, enabling greater speed and the ability to accommodate the industry’s move toward packaging numerous “chiplets” into more powerful large processors, a configuration that has proven beneficial for the acceleration that drives artificial intelligence. This technology could potentially vault Intel ahead of competitors, some say. Continue reading Intel Has Plans to Power AI with Glass Substrates for Its Chips

Tech Firms Join Pixar in Group Promoting OpenUSD Standard

Led by Pixar Animation Studios, a consortium of tech companies has formed the Alliance for OpenUSD to promote an open 3D computer graphics standard for the metaverse and other 3D projects. Adobe, Apple, Autodesk and Nvidia are also founding members along with the Linux Foundation’s Joint Development Foundation. The group will promote the development and standardization of Pixar’s Universal Scene Description tech, a 3D platform that is interoperable across a variety of tools, data and workflows. The goal is to make it easier to describe, compose and simulate large-scale 3D imaging projects and services across industries and platforms worldwide. Continue reading Tech Firms Join Pixar in Group Promoting OpenUSD Standard

Samsung to Take on Apple with Upcoming Galaxy S23 Ultra

What some call “Apple’s unchecked dominance” in mobile phones may get a real challenge from Samsung’s upcoming Galaxy S23 Ultra, expected to hit the market in Q1. The new model will be powered by Qualcomm’s Snapdragon 8 Gen 2 chips, which benchmarks have shown to be fast approaching the performance of Apple’s A16 Bionic. There is also a rumor that Samsung may take a page from Google and Apple and begin designing bespoke phone chips. Samsung already has a chip foundry, but it is independent of the company’s mobile unit, a Switzerland for its diversity of phone customers. Continue reading Samsung to Take on Apple with Upcoming Galaxy S23 Ultra

IBM Teams Up with Rapidus Foundry on Chip Manufacturing

Japan, once the world’s top producer of computer chips, is seeking to regain its foothold in the manufacture of leading-edge semiconductors. Last month, a consortium of eight Japanese companies formed Rapidus, a foundry the Japanese government hopes will help get the nation on track for advanced chip manufacturing. IBM Research is joining forces with Rapidus, with plans to manufacture IBM’s 2nm technology in fabs that Rapidus is building in Japan, with output expected to commence in the latter half of the decade. Continue reading IBM Teams Up with Rapidus Foundry on Chip Manufacturing

Intel to Restructure Chip Design and Manufacturing Divisions

Intel is fine-tuning its corporate reporting as it gears up a foundry operations that will see the longtime manufacturer and designer of its own chips extend services to third-parties. The idea is to create greater separation between its concept and creation divisions. The change comes as Intel deals with a rapidly shifting global market, where demand for chips has increased in sectors like automotive and AI data centers while the PC business that has been the company’s bedrock suffered a major decline in global shipments of nearly 20 percent in Q3. Continue reading Intel to Restructure Chip Design and Manufacturing Divisions

Samsung 5-Year Plan Speeds Advanced-Chipmaking Timeline

Samsung wants to dominate the global market for advanced semiconductors, unveiling plans to begin producing chips with a 2-nanometer spec in 2025 and launching into the even more advanced 1.4-nanometer market in 2027. The timeline takes the South Korean company beyond the 3-nanometer chip production it began in June. Samsung says it will more than triple production capacity in five years, positioning it to challenge Taiwan’s TSMC in terms of volume, and potentially surpass it in the high-end market for “smart chips.” TSMC said it will mass produce 3nm chips this year and start 2nm production by 2025. Continue reading Samsung 5-Year Plan Speeds Advanced-Chipmaking Timeline

vETC to Discuss Virtual Production During SIGGRAPH

The Entertainment Technology Center@USC will host its 6th vETC virtual conference at SIGGRAPH 2022 in Vancouver, British Columbia, August 9-11. During this year’s vETC at the Amazon Web Services booth (1039), speakers will present concepts, workflows, business models and case studies as they apply to virtual production. Many of the companies that worked on ETC’s latest R&D film project, “Fathead” will discuss their discoveries in sessions that will be recorded and posted on ETC’s YouTube channel. The 3-day program with list of speakers and gear to be demonstrated is available on the ETC site. Continue reading vETC to Discuss Virtual Production During SIGGRAPH

Intel Announces Plans for New $20 Billion Chip Plant in Ohio

Intel is building a new $20 billion chip foundry in Ohio, where CEO Patrick Gelsinger says the company envisions investing more than $100 billion over the next decade to create a complex of up to eight plants. The move is part of a U.S. effort to increase domestic production of computer chips, alleviating supply chain shortages and reducing reliance on foreign suppliers. The new build, located near Columbus, is an economic boon for Ohio, creating 7,000 construction jobs and eventually employment for about 3,000 people in two flagship factories, and potentially many more jobs through the satellite suppliers nearby. Continue reading Intel Announces Plans for New $20 Billion Chip Plant in Ohio

Samsung Plans to Construct a $17 Billion Chip Plant in Texas

Samsung has announced plans to build a $17 billion chip plant in Taylor, Texas. The news comes on the heels of a government push to jump-start more U.S. semiconductor manufacturing and Senate approval of $52 billion in industry subsidies for new processor factories. The South Korea-based electronics giant already operates a chip fabrication plant in Austin, Texas, opened in 1997 and expanded in 2007. The Taylor facility will create new sourcing for chips, which have become precious amidst a global shortage, although the new factory is not expected to become operational until 2024. Continue reading Samsung Plans to Construct a $17 Billion Chip Plant in Texas

HPA Tech Retreat: Latest From Academy Software Foundation

In 2018, the Academy of Motion Picture Arts and Sciences established the Academy Software Foundation, with the mission of increasing the “quality and quantity of open source contributions … [to] lower the barrier to entry for developing and using” it. Its genesis was a survey conducted by the AMPAS Science and Technology Council that found 84 percent of those in the media & entertainment industry used it — but had challenges. At HPA Tech Retreat, ASWF executive director David Morin updated the group’s activities. Continue reading HPA Tech Retreat: Latest From Academy Software Foundation

AMPAS, Linux Foundation Team Up for Open Source Software

The Academy of Motion Picture Arts and Sciences and The Linux Foundation announced this morning the launch of the Academy Software Foundation (ASWF) to create an environment for developers to contribute to open source software for the motion picture and related media industries. Industry partners funding and participating in ASWF include Animal Logic, Autodesk, Blue Sky Studios, Cisco, DNEG, DreamWorks, Epic Games, Google Cloud, Intel, Walt Disney Studios, Weta Digital, with Foundry and SideFX. Continue reading AMPAS, Linux Foundation Team Up for Open Source Software

SIGGRAPH 2015: Google Cloud Announces Cloud-Native Rendering

Google Cloud Platform announced the public beta of Zync, its cloud-native rendering solution. Google acquiredZync last August to incorporate specialized computing capabilities for visual effects production in the cloud.  According to Google’s representative, “As part of Zync, artists will get access to 1,600 dedicated Compute Engine cores to power your V-Ray, Arnold and Nuke-based renders. Integration of the upcoming release of the popular Renderman software with Zync by Google Cloud Platform was also announced. Continue reading SIGGRAPH 2015: Google Cloud Announces Cloud-Native Rendering

Turn Your iPad into a 3D Scanner with New Structure Sensor

San Francisco-based startup Occipital, creator of the 360 Panorama app and RedLaser barcode-scanning app acquired by eBay, is developing a 3D scanning accessory for iPads called the Structure Sensor. Inspired by the sensor technology of Microsoft’s Kinect, CEO Jeff Powers decided to change the direction of Occipital to develop a new scanning tool. The result is the Structure Sensor, which earned the company more than $250,000 in a single day through its Kickstarter campaign. Continue reading Turn Your iPad into a 3D Scanner with New Structure Sensor