Big Tech Firms Propel Hugging Face to $4.5 Billion Valuation

Hugging Face has collected $235 million in an investment round that includes contributions from Amazon, IBM, Google, Nvidia, Salesforce, AMD, Intel and Qualcomm. The New York-based startup creates and distributes open-source tools for artificial intelligence development, carving an AI-centric niche similar to the more general programming approach taken by the Microsoft-owned GitHub. The incoming cash infusion — earmarked for talent recruitment — gives Hugging Face a lofty $4.5 billion valuation that experts say indicates momentum for open source in what has to date been a highly competitive AI sector. Continue reading Big Tech Firms Propel Hugging Face to $4.5 Billion Valuation

AI Helps Steer Nvidia Toward $1 Trillion Market Capitalization

Nvidia announced $7.19 billion in revenue for the first quarter ended April 30. That’s down 13 percent compared to the February through April frame in 2022, but up 19 percent from Q4, which ended January 29. Nvidia has forecast a stunning $11 billion in sales for Q2. That projected 64 percent increase puts Nvidia on track to be the first chip company with a $1 trillion valuation. CEO Jensen Huang attributes the sales spike to exploding demand for GPUs to run artificial intelligence systems. “We are significantly increasing our supply to meet surging demand for them,” Huang said of the processors. Continue reading AI Helps Steer Nvidia Toward $1 Trillion Market Capitalization

Applied Materials Plans Chip Research Center in Silicon Valley

Santa Clara, California-based Applied Materials, which makes equipment used to produce semiconductors, has announced plans to invest up to $4 billion in a research facility in Silicon Valley. The Equipment and Process Innovation and Commercialization (EPIC) Center, which will be built over seven years, aims to bring chipmakers and universities together to collaborate on innovations that will result in more powerful chips. “For the first time, chipmakers can have dedicated space within an equipment company’s R&D fab, providing early access to next-generation processes and equipment to accelerate product roadmaps,” according to Applied Materials. Continue reading Applied Materials Plans Chip Research Center in Silicon Valley

Meta In-House Chip Designs Include Processing for AI, Video

Meta Platforms has shared additional details on its next generation of AI infrastructure. The company has designed two custom silicon chips, including one for training and running AI models and eventually powering metaverse functions like virtual reality and augmented reality. Another chip is tailored to optimize video processing. Meta publicly discussed its internal chip development last week ahead of a Thursday virtual event on AI infrastructure. The company also showcased an AI-optimized data center design and talked about phase two of deployment of its 16,000 GPU supercomputer for AI research. Continue reading Meta In-House Chip Designs Include Processing for AI, Video

Advanced Packaging for ‘Chiplets’ a Focus of CHIPS Funding

Ten years ago AMD introduced the concept of smaller, interconnected chips that together work like one digital brain. Sometimes called “chiplets,” they’re generally less expensive than building one large chip, and when grouped together into bundles have often outperformed single wafters. In addition to AMD, companies including Apple, Amazon, Intel, IBM and Tesla have embraced the chiplet formula, which leverages advanced packaging technology, an integral part of building advanced semiconductors. Now experts are predicting packaging is going to be even more of a focus in coming years, as the global chip wars heat up. Continue reading Advanced Packaging for ‘Chiplets’ a Focus of CHIPS Funding

AMD Touts Advance in AV1 Encoding for Streaming Services

AMD is introducing a new encoder chip designed for energy efficient and economical AV1 video streaming. The AV1 codec is increasingly popular as streamers seek to meet massive bandwidth needs. AMD’s new card, the Alveo MA35D, delivers what promises to be a massive leap in throughput and compression over its predecessor. Compression performance is critical in today’s streaming market, where the model has changed from a one-to-many central server model to a cloud-based distributed many-to-many format as entertainment is vying for bandwidth with video conferences, massively multiplayer online games and social media streaming. Continue reading AMD Touts Advance in AV1 Encoding for Streaming Services

CES: Asus Upgrades Popular ROG Zephyrus Gaming Laptops

At CES 2023, Asus refreshed this year’s models of its popular ROG Zephyrus gaming laptops. The new flagship M16 comes tricked out with 13th Gen Intel i9 and Nvidia RTX 4090 graphics. The RTX 4080 variant starts at $3,900. Also arriving in the first quarter of 2023 are updates on the G14 and ROG Zephyrus Duo 16, with options including AMD Ryzen 9 Zen 4 or 13th Gen Intel processors and Nvidia GeForce RTX 40 Series GPUs. On the display front Asus offers the ROG Nebula, powered by mini-LED powered Nebula HDRs. Next-gen cooling rounds out the package. Continue reading CES: Asus Upgrades Popular ROG Zephyrus Gaming Laptops

CES: Displace Demos First Totally Wireless OLED Flat Screen

Displace is a new wireless TV that promises to take the pain out of mounting a flat screen. Powered by a proprietary hot-swappable battery system, the 55-inch 4K flat screens are under 20 pounds and can be affixed “to any surface” using an active-loop vacuum technology. Transportable and configurable, multiple Displace TVs can be used in combination “to form any sized TV,” according to the startup, which debuted the system at CES 2023. Each Displace TV comes with four rechargeable batteries, each averaging about a month of life for an average usage of six hours per day. Continue reading CES: Displace Demos First Totally Wireless OLED Flat Screen

CES: Magic Leap 2 Exhibits Impressive Dimming Capabilities

The most impressive feature of the Magic Leap 2 demo at CES 2023 involves Global and Segmented Dimming. Global Dimming is a feature that dims the entire display without dimming digital content to make text and images more solid and precise. Segmented Dimming dims specific portions of the display to enhance legibility and clarity of selected content, and can also be used to focus attention to areas or components of interest. Both of these features produced outstanding visual results during our CES demo. Segmented Dimming produced very bright digital objects in front of a well-lit room, while Global Dimming could be used for VR immersion. Continue reading CES: Magic Leap 2 Exhibits Impressive Dimming Capabilities

CES 2023: What to Expect When the Show Opens in January

For four days in Las Vegas, CES 2023 becomes the nucleus of global innovation. The Consumer Technology Association (CTA), owner of CES, predicts a show significantly larger than CES 2022, emerging from two pandemic restricted years on January 5. The annual confab will open more than two million square feet of exhibit space with more than 2,400 exhibitors and the expectation of as many as 100,000 attendees, more than double the last show. ETC@USC will have its team in place, on the ground and online, to explore the show floor and over 175 sessions and keynotes. We’ll be reporting on the latest in AI, Web3, multiverses, image displays and other emerging CE tech impacting M&E. Continue reading CES 2023: What to Expect When the Show Opens in January

TSMC’s Advanced Chipmaking Plans Leak Before Biden Visit

TSMC has revised plans for its Arizona chip plant, reportedly the result of pressure from customers including Apple, Nvidia and AMD, who urged the Taiwanese company to reconsider its plan to output 5-nanometer processors that will be old news by the time the $12 billion plant opens in 2024. TSMC is expected to announce during a scheduled Tuesday visit by President Biden and Commerce Secretary Gina Raimondo that it will output advanced 4-nanometer chips when production commences and will add a second nearby plant to manufacture even more sophisticated 3-nanometer chips. Continue reading TSMC’s Advanced Chipmaking Plans Leak Before Biden Visit

AWS Touts HPC with Launch of Graviton3E Chip at re:Invent

Amazon Web Services, a leading provider of cloud computing services, is rolling out its new ARM-based Graviton3E chips for high-performance workloads, including tasks like weather forecasting and gene sequencing. AWS customers can rent the high-performance computing (HPC) power to take advantage of “performance gains and cost savings” as a result of making its own chips, Amazon says. The move makes AWS something of a competitor to other top chipmakers, including Intel, AMD and Nvidia, who continue to be among Amazon’s major chip suppliers. Amazon says it will continue to offer HPC services that rely on third-party chips. Continue reading AWS Touts HPC with Launch of Graviton3E Chip at re:Invent

New Chip Licensing Model Introduced with ‘Intel On Demand’

Intel is shaking up the business model for computer chips, debuting Intel On Demand, a software-defined silicon (SDSi) service designed to get customers to pay to enable features built into future Xeon server processors. The move signals a major change in how computer chips are marketed and could increase flexibility in how organizations configure their infrastructure. While Intel hasn’t indicated whether SDSi will be mandatory for users buying next-gen Xeons, the concept has created some concern among IT professionals, many of whom view it as charging extra for features that are already hardwired into the silicon. Continue reading New Chip Licensing Model Introduced with ‘Intel On Demand’

Intel Targets Supercomputing with New Max Series CPU, GPU

Intel is taking on Nvidia and AMD with its Max Series for high performance computing and artificial intelligence. The company unveiled two products under the Max umbrella: the Intel Xeon Max CPU and the Intel Data Center Max Series GPU. The Max GPU is Intel’s highest density processor, packing over 100 billion transistors into a 47-tile package with up to 128GB of high-bandwidth memory. The oneAPI open software ecosystem provides a single programming environment for both new processors, with Intel’s 2023 oneAPI and AI tools enabling the Intel Max Series products’ advanced features. Continue reading Intel Targets Supercomputing with New Max Series CPU, GPU

Nvidia Offers Advanced Chip to Clear U.S. Export Control List

Nvidia becomes the first stateside chipmaker to launch a product in China that manages to clear strict U.S. export hurdles aimed at keeping high-end processors out of the territory. Computers with the new Nvidia chip, the A800, are already selling in China. Publicly traded Nvidia had been concerned the export limits could divert hundreds of millions of dollars from its bottom line. In October, U.S. regulators effectively banned shipments of advanced microchips and the equipment required to make them in order to bolster national security and thwart Chinese weaponization. Continue reading Nvidia Offers Advanced Chip to Clear U.S. Export Control List